On April 7, 2009, KLA-Tencor introduced the TeraScanXR, the latest version of their TeraScan reticle inspection system, this one intended for 32nm node DUV masks. This new tool, an extension of existing reticle inspection systems, is designed to provide mask manufacturers better sensitivity, lower cost-per-inspection and faster mask dispositioning. Improvements in overall sensitivity in die-to-die […]
IMEC has begun expanding its beautiful Leuven, Belgium campus facilities, starting with 2,800 square-meters of research labs and including the extension of its state-of-the-art clean room. With this extension, IMEC will expand its research on 22nm CMOS and beyond, low-cost and high-efficiency solar cells, and biomedical electronics. The Flemish Government invests 35 million euro and […]
Semiconductor Equipment and Materials International (SEMI) collects and reports market size information for key sectors of the semiconductor ecosystem. It recently issued figures for the materials market, which in 2008 totaled $42.7 billion, essentially flat with the prior year. According to SEMI, rapidly slowing economic conditions in the fourth quarter squelched prospects for year-over-year growth […]
Applied Materials and Disco announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSV) for future 3D IC stacks. The two companies, world leaders in thin-films and thinning (respectively) for silicon wafers, will be working together to develop integrated, high-performance process flows intended to lower the cost, reduce the risk and […]
The SPIE Europe Microtechnologies For the New Millennium congress has new partners this year, with the involvement of GMM, the Society of Microelectronics, Micro and Precision Engineering and the magazine mst|news as Cooperating Organisations for the first time. The event will be held at the Congress Centre Maritim Hotel in Dresden, Germany, 4-6 May 2009. […]
The control of complex interdependencies is critical for the successful manufacturing of nanometer-scale ICs. Every aspect of every unit process step in the line must be ever more tightly controlled to ensure that 45nm and 32nm node chips can be made with good yield. To serve the market, Novellus continues to announce new integrated surface-treatment […]
Asahi Glass is promoting a family of new photosensitive spin-on-dielectric (SOD) films for fan-out WLP and 3D packages, as well as for FPD and MEMS applications. The Chemicals Fluoroproducts Division of Asahi Glass has successfully developed the AL-X polymer series, primarily targeting the redistribution/rewiring layers in fan-out WLP packages. The company will begin production of […]
Semilab, founded in 1990 and headquartered in Budapest, Hungary, is spending cash to continue to expand its portfolio of fab metrology offerings. Today, the company announced it has acquired Advanced Metrology Systems (AMS) and QC Solutions. The two Massachusetts-based metrology companies expand Semilab’s family of scalable, flexible solutions to help semiconductor and solar manufacturers characterize […]
The principles of “causality” and “boundary conditions” are fundamental to modern science, and when you apply these principles to the system of human energy production/consumption it tends to lead to thoughts of TeraWatt Challenges and limiting demand. Raw energy limits need not equate with lifestyle limits, if new technologies allow us to be far more […]
Materials research and engineering continues to increase in structural complexity. Starting from the periodic table of the elements and molecular engineering, over a century of research has explored most obvious phenomena of bulk and thin-film materials. What, then, is left to explore? The vast complexity of natural micro- and nano-scale structures that are indirectly templated […]