Microbridge Technologies, the inventor of passive, analog, MEMS-based precision IC calibration products known as rejustors, announced it has successfully closed an internal round of funding to build out a new presssure sensor family of chips. “The company will launch a line of Micro-Flow pressure sensors that achieve new levels of performance for a wide range […]
Allvia, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in a round of funding to expand manufacturing facilities and to build more capacity. After 3 years of revenue generation from providing vertical interconnects and System-in-Package (SiP) solutions, total investment in the company is now $25 million. With in-house processing equipment, […]
Veeco has exited betas with a new Atomic Force Microscope (AFM) named Dimension® Icon™ that provides small-sample resolution for large-samples. Building upon the successful Dimension AFM platform, the latest member of the product line delivers the highest resolution, best ease-of-use, and fastest time-to-results of any large-sample AFM on the market today. “With the Icon AFM, […]
Ziptronix wants to help you with your 3D roadmap. The IP spin-out from Research Triangle Park, NC is now actively negotiating licenses to its unique wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding technologies. Using treated-oxide (with surface treatments) and nickel (with a mystery metal) as the connecting materials, room temperature bonding with up to 108/cm2 of […]
Silicon Clocks, the developer of custom semiconductor timing solutions that has reinvented itself as a “custom product development house” with a new CEO, has announced a new product based on its CMOS-MEMS (CMEMS) embedded approach. CMEMS-ZeroThermal passive temperature compensation resonators exhibit comparable temperature stability to quartz crystals, while drastically simplifying oscillator design, and reportedly reducing […]
As SEMI’s SMC today, Raymond Roberge, SVP and CTO of Praxair Electronics, proposed a pragmatic new collaboration model for electronic materials R&D. Semiconductor fab process materials TAM for 2008 was ~$10B, yet materials suppliers now question their ongoing profitability. “Certainly the 300mm shift has resulted in productivity advances for IDMs at the expense of materials […]
Smart Equipment Technology (S.E.T.), a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced yesterday that it will collaborate with IMEC on 3DIC R&D. IMEC’s 3D integration program explores 3D technology and design for applications in various domains, focusing on 3D WLP […]
At SEMI’s Industry Strategy Symposium (ISS) running at Half Moon Bay, California today, IMEC president and CEO Gilbert Declerck talked about the need for R&D to facilitate IC industry growth. An industry based on answering the question, “what have you done for me lately?” can never rest on past successes and must continue to innovate. […]
This is the first example of a posting to BetaSights new BetaBlog. New posts will appear most working days, so bookmark this site and check back regularly. BetaSights was founded in the fall of 2008 by industry veterans Ed Korczynski and Elizabeth Schumann, to provide commercial free, member supported, productive info about fab beta sites. […]