Archive for April, 2009
Thursday, April 30th, 2009
Human intellectual development has eclipsed emotional development, with the resulting problem of clever people lacking morals. In government, industry, and academia there are endless examples of this problem, which is now threatening the economy due to corruption, and the very biosphere of the earth due to pollution. It is heartening that MIT (that trained most […]
MIT opens Dalai Lama center for ethics
Tags: ethics, PV, R&D
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Wednesday, April 29th, 2009
Thermal management of advanced ICs remains challenging, with models often failing to predict the heat flow through multiple films and interfaces. Advanced Thermal Solutions (ATS) of Norwood, Massachusetts (US) will provide a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to engineers who need to perform thermal testing of their heat sinks, […]
Free thermal characterization lab time
Tags: characterization, FPD, IC, MEMS, Service, test, thermal
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Thursday, April 23rd, 2009
Silicon Valley has certainly not been immune to the current economic conditions, with many companies announcing multiple rounds of layoffs and moving operations overseas. Yet for many it is still considered “the heart” of the high-tech industry. At today’s well-attended Silicon Valley Lunch Forum, organized by the Sales and Marketing Council of SEMI, three speakers […]
Silicon Valley fab futures seen at SEMI lunch forum
Tags: 200mm, CMOS, fab, IC, printed, PV, R&D, Si
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Wednesday, April 22nd, 2009
Researchers at MIT have demonstrated deep subwavelength lithography using a photochromic contrast enhancing layer, as reported in SciencExpress April 9. A thin photochromic film on top of a conventional photoresist layer was exposed to two wavelengths of light with two distinct patterns. One wavelength exposed the photoresist while the other made the photochromic film opaque […]
Deep sub-wavelength nanopatterning
Tags: 22nm, 32nm, DP, IC, litho, LLE, mask
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Tuesday, April 21st, 2009
IMEC has successfully transferred memory variability aware modeling (MemoryVAM), the first EDA tool for statistical memory analysis, to Samsung Electronics. The tool predicts yield loss of embedded SRAMs caused by the process variations of deep-submicron IC technologies. This may be the first proven design-for-manufacturing (DFM) tool to provide statistical analysis across degrees of abstraction from […]
IMEC eSRAM DFM tool to Samsung
Tags: 32nm, 45nm, DFM, EDA, eSRAM, IC, process, SRAM, variation, yield
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Monday, April 20th, 2009
The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]
MRS spring meeting beyond Silicon Valley
Tags: 32nm, 3D, CMOS, FPD, high-k, HKMG, IC, low-k, materials, memory, MEMS, NVM, PV, R&D, Si
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Thursday, April 16th, 2009
Abound Solar (formerly AVA Solar), a manufacturer of CdTe thin-film photovoltaic (PV) solar panels, announced the opening of its first full-scale production facility in Longmont, Colo. This facility uses a proprietary manufacturing process that is claimed to significantly reduce production costs of solar panels. The fully automated facility will create more than 300 new jobs […]
Abound Solar opens first fab
Tags: CdTe, fab, PV, solar, thin-film
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Wednesday, April 15th, 2009
The first example of all-optical signal processing for communication above 100Gbit/s using silicon-based devices has been published in the April issue of Nature Photonics. Using deep-ultraviolet lithography, standard CMOS processing and organic molecular beam deposition, researchers from the University of Karlsruhe, IMEC and its associated laboratory INTEC at Ghent University, Lehigh University and ETH Zurich […]
IMEC enables Si-based all-optical IC
Tags: CMOS, DUV, IC, materials, Si
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Tuesday, April 14th, 2009
sp3 Diamond Technologies – the supplier of diamond film products, equipment, and services – today announced it is taking orders for 50mm and 100mm silicon on diamond (SOD) wafers for use as Gallium Nitride (GaN) substrates. Having worked with Nitronix on the GaN, sp3 Diamond Technologies uses combinations of thin-film depositions, wafer thinning, and layer […]
Silicon on Diamond 100mm wafers for GaN
Tags: 100mm, epi, GaN, HEMT, IC, LDMOS, materials, MOCVD, Si, SiC, SOD, thin-film, wafer
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Monday, April 13th, 2009
Intermolecular, the combinatorial R&D company that has been working on semiconductor fab processes, plans to grow solar R&D to possibly be the largest portion of the company’s business. Under the leadership of new vice president and general manager of solar business group Craig Hunter (who joined from Applied Materials), Intermolecular is now working on both […]
Intermolecular PV plans
Tags: PV, R&D, Si, TCO, texture, thin-film, ZnO
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