Friday, May 8th, 2009
Today, Intel sponsored a history of the planar IC event at the Computer History Museum, in Mountain View, California. This, in the same week that the company pre-launches a new advertising campaign to try to position the company as “Sponsors of Tomorrow.” Based on the live event, the past was seriously wonderful. Based on these […]
Intel – sponsors of yesterday
Tags: Al, bipolar, boron, diffusion, fab, IC, MOS, NPN, R&D
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Friday, May 1st, 2009
Leaving California for the first time, the 12th annual IEEE International Interconnect Technology Conference (IITC) will take place in Sapporo, Japan, June 1-3. With lithographic shrinks in 2D dimensions slowing, interconnects between chips in packages and in 3D stacks will be the driver for increased density and functionality in ICs. Thus, the more than 80 […]
IITC in Sapporo for 22nm interconnects and 3D
Tags: 22nm, 32nm, 3D, 45nm, 65nm, contact, Cu, dielectric, IC, integration, low-k, TSV, W
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on IITC in Sapporo for 22nm interconnects and 3D