Monday, March 22nd, 2010
The upcoming Spring Materials Research Society (MRS) Meeting in San Francisco will feature a separate “Nanocontact and Nanointerconnects Workshop” to explore the biggest secret about the smallest devices: for the near-term there’s nothing better than standard metal. The workshop will address both theoretical and experimental approaches to formation, carrier transport, and reliability, and so will […]
How to connect to nano devices
Tags: 22nm, CMOS, CNT, Cu, FET, FPD, IC, memory, MEMS, nano, PV, R&D
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Monday, March 15th, 2010
Another back-to-the-future possibility for next-generation lithography (NGL) is direct write e-beam (DWEB), revitalized with multibeam clusters, curvilinear mask writing, and character projection (CP). The E-beam Initiative used the recent SPIE gathering to announce that it had added six new member companies, including GlobalFoundries and Samsung. Aki Fujimura, CEO of D2S and Managing Director of the […]
E-beam clusters, curves, and characters
Tags: 193nm, 22nm, 32nm, EbDW, EUV, HKMG, IC, litho, mask, NGL
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Monday, March 8th, 2010
This year’s plenary sessions of the SPIE Advanced Lithography Symposium exposed the complexities of patterning ICs in high-volume manufacturing (HVM) at the 22nm node and beyond. Steppers using 193nm ArF immersion (193i) will be extended using double-patterning (DP) schemes, since the extreme-ultra-violet litho (EUVL) infrastructure is again delayed. R&D to support DP integration has led […]
SPIE Plenaries: double-patterning and two-tone resist
Tags: 16nm, 193nm, 22nm, 32nm, EbDW, EUV, IC, inspection, litho, mask, NIL, RET, reticle, SMO
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Monday, March 1st, 2010
Molecular Imprints, Inc, announced their first nanopatterning tool designed for pilot and volume production of patterned hard disc drive (HDD) substrates at the SPIE Advanced Lithography Symposium in San Jose, CA February 22. The NuTera HD7000 uses Jet and Flash Imprint Lithography (J-FIL) technology to print over 300 double sided disks per hour up to […]
Molecular Imprints HDD production tool and IC plans
Tags: 22nm, HDD, HVM, litho, NGL, NIL
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