Archive for August, 2010

Wednesday, August 25th, 2010

For 32nm and 22nm node ICs, Applied Materials’ FCVD and Novellus Systems’ CFD technologies provide gapfill, sidewall spacers, and conformal oxides for logic and NAND, plus SSDP litho.

IC industry contracts new VDs: CFD and FCVD
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Tuesday, August 17th, 2010

Post-optical lithography (NGL) technologies EUV (EUVL), e-beam direct-write (EbDW), and nano-imprint (NIL) all need work as shown at SEMICON/West 2010, major costs limitations.

Lithography beyond the financial limit
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Thursday, August 5th, 2010

SEMICON/West 2010 lithography changes were slight, TEL showed quadruple-patterning with ALD sidewall spacers and tools, Nikon and ASML with IMEC also showed double-patterning

Steady as she goes: Optical Lithography
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