Thursday, September 23rd, 2010
TSV for 3D integration of heterogeneous ICs used in interposers first, as shown at SEMICON/West, IMAPS, IEDM and companies like ASE, Alchimer, Suss, EVG, Novellus, Vertical Circuits, and IBM.
TSV ready in interposers at OTAPs
Tags: 3D, ASE, Cu, ECD, etch, IC, IEDM, IMAPS, Novellus, OTAP, PVD, Qualcomm, TSV
Posted in Equipment, fab, IC, Material, MEMS, Product, Service | Comments Off on TSV ready in interposers at OTAPs
Tuesday, September 14th, 2010
E-beam Initiative adds four members and starts on Design for E-beam (DFEB) for mask makng for ICs to reduce mask costs at 22nm and below.
E-beam Initiative speeds mask making
Tags: 193i, 22nm, 32nm, BACUS, CDU, D2S, DFM, e-Beam Initiative, EbDW, IC, Intel, litho, mask, node, SPIE, SRAF
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on E-beam Initiative speeds mask making
Tuesday, September 7th, 2010
HP and Hynix JVA for ReRAM chips, based on HP titania memristor as covered by BetaSights April 2010, with R&D fab in Korea to start work on integration on 300mm silicon wafers for 2013 IC chips
HP with Hynix for ReRAM in 2013
Tags: 16nm, 22nm, AI, DRAM, etch, Flash, HDD, IC, litho, logic, memory, memristor, NAND, PVD, R&D, ReRAM, SSDP
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on HP with Hynix for ReRAM in 2013
