At SEMICON Korea 2009, SUSS MicroTec unveiled the second generation of its ACS300, a modular system for coating, baking and developing of wafers up to 300mm. Compared to the prior generation, the Gen2 tool reportedly costs less, has reduced footprint, and offers configuration flexibility with new capabilities. The system architecture and process modules are specifically adapted to the needs of the advanced packaging and 3D integration industry, which must process up to 100µm thick photo resist layers, and thick films of polyimide, PBO, and BCB.

ACS300 Gen2 HCV module stacks (source: SUSS)

The Gen2 tool was based on a complete platform redesign to reduce the footprint, with a single robot to serve two I/O modules. One process module can be equipped with heating/cooling/vapor-prime (HCV) stacked plates to avoid throughput bottlenecks. The new platform also creates additional space for sub-systems such as pumps, tanks, heat exchangers, and filters so that modifications can be made in the field to adapt to new processing requirements.

“Addressing the specific requirements for wafer level packaging and 3D integration the new ACS300 is equipped with various packaging specific features, which makes it specifically suited for applications like solder bumping, gold bumping or redistribution layers,“ said Rolf Wolf, General Manager of SUSS MicroTec Lithography Division. The ACS300 Gen2 can be interfaced with the MA300 Gen2 proximity mask aligner to form the integrated LithoPack300 cluster.

For 3DIC applications that use thinned silicon wafers, the typically needed “handle” wafer (usually made of silicon or quartz) adds mass that makes handling more difficult. The robot on the new tool has been upgraded to a 6-axis unit that combines high-speed and accuracy, and can handle a payload of up to 5kg such as a multi-wafer-stack or a carrier solution. Since SUSS is a trusted OEM with proven history through the Gen1 tool, the new Gen2 tool has already commanded two orders from customers without first having to show beta data. –E.K.

Tags: 300mm, 3D, IC, lithography, OEM, packaging, tool, track

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