Wednesday, April 8th, 2009
IMEC has begun expanding its beautiful Leuven, Belgium campus facilities, starting with 2,800 square-meters of research labs and including the extension of its state-of-the-art clean room. With this extension, IMEC will expand its research on 22nm CMOS and beyond, low-cost and high-efficiency solar cells, and biomedical electronics. The Flemish Government invests 35 million euro and […]
IMEC at 25 still growing
Tags: 22nm, 450mm, CMOS, IC, organic, PV, R&D, Si
Posted in fab, IC, MEMS, Product, PV, Service | Comments Off on IMEC at 25 still growing
Thursday, March 26th, 2009
German and French teams are combining EUR 14.5m investment into development of strained-silicon on insulator (sSOI) technology under the DEvice and CIrcuit performance boosted through SIlicon material Fabrication (DECISIF) program. The work will combine original research results from Research Center Juelich and Leti/Soitec to try to lower costs and defect-densities in the creation of 300mm […]
DECISIF start on strained silicon
Tags: 22nm, 32nm, 45nm, CVD, EDA, epi, IC, implant, integration, Material, Si, SiGe, SOI, sSOI, strain, wafer
Posted in fab, IC, Material, Product | Comments Off on DECISIF start on strained silicon
Wednesday, March 11th, 2009
Nanometrics today announced the release of Version 2.0 of its NanoCD Suite of solutions for optical critical dimension (OCD) metrology, just one year after V1 was released. OCD (a.k.a., “scatterometry”) has been used to successfully control fab processes for many years. The major known limitation of the technique is model building from reference metrology data, […]
Nanometrics next NanoCD Suite for OCD
Tags: 22nm, 32nm, CD, CMP, etch, fab, finFET, high-k, HK, IC, metal-gate, metrology, MG, OCD
Posted in Equipment, fab, IC, Product | Comments Off on Nanometrics next NanoCD Suite for OCD
Wednesday, March 4th, 2009
Electron beam direct write (EBDW) lithography is well-developed and has better potential resolution than any other method, but writing speeds did not keep up with Moore’s law after about 1980, leading to abysmal throughput (measured in hours per wafer). Now, the e-Beam Initiative focusing on design for e-beam manufacturing (DFEB) and multibeam writing using MEMS […]
eBeam Initiative and tool competition
Tags: 22nm, 32nm, 45nm, e-beam, EbDW, IC, litho, node
Posted in Equipment, fab, IC, MEMS, Product | Comments Off on eBeam Initiative and tool competition