As computational lithography has become big big business, the pioneering enterprises have been assimilated into larger organizations (KLA-Tencor for Finle and Synopsys for Sigma-C, to name two examples). Panoramic Technology, however, continues its independence, supplying trustworthy and up-to-date simulators to advanced lithographers for a decade. Past Panoramic products, however, employed an interface that was familiar […]
JSR announced today that it has entered into several joint development partnerships (JDP) with IBM to develop low-k dielectrics for 32nm and 22nm nodes of semiconductor technology. The companies will work on next generation materials JSR has had in development and commercial production, including low-k dielectrics and a broad range of photoresists. “This larger scale […]
For thick plating applications like copper pillar bump processing in semiconductor advanced packaging, Shin-Etsu MicroSi has introduced a positive tone, ultra-thick photoresist, SIPR-7126. The 7100 chemically amplified (CA) series has been in production for several years, and the SIPR-7126 has been optimized to reduce processing steps and improve removability in layers up to 100 µm […]
Metrosol has joined SEMATECH’s Front End Process Technologies Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany to address metrology and data-analysis solutions for 45nm node and beyond IC fabs. The joint partnership will expand on current work to develop inline metrology techniques to monitor the thickness and composition […]
Evident Technologies has announced the issuance of US Patent No. 7,482,059 covering the ability to synthesize a quantum dot with a metal layer which dramatically enhances the brightness and stability of a semiconductor nanocrystal complex. This advance of semiconductor materials science relies on a relatively low-cost colloidal formation processing, instead of needing epitaxial lattice-matching or […]
At Levitronix’s Ultrapure Fluid Handling and Wafer Cleaning Conference on February 11th, Particle Measuring Systems reviewed the limits of being able to detect things we do not want to find in flowing fluids, as enabled by a new digital detector array they call NanoVision Technology. Steven Verhaverbeke, tool design expert for Applied Materials who presented […]
CMP applications experts gathered in Santa Clara, California on February 10th to share their experience and expertise at the fifth annual seminar sponsored by Levitronix. Leading developers, manufacturers, and end-users of CMP discussed all aspects of the technology, and since Levitronix makes magnetic levitation (MagLev) pumps there were many thorough presentations on slurry distribution issues. […]
Toshiba claims the prototype of a new Ferroelectric Random Access Memory (FRAM) cell sized at 15F2 acheives read and write speed of 1.6-GB/s using a 130nm node CMOS process. The company will show details of this high bandwidth 128Mb non-volative RAM technology at the International Solid-State Circuits Conference 2009 (ISSCC 2009; Session 27.5) in San […]
Microbridge Technologies, the inventor of passive, analog, MEMS-based precision IC calibration products known as rejustors, announced it has successfully closed an internal round of funding to build out a new presssure sensor family of chips. “The company will launch a line of Micro-Flow pressure sensors that achieve new levels of performance for a wide range […]
Allvia, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in a round of funding to expand manufacturing facilities and to build more capacity. After 3 years of revenue generation from providing vertical interconnects and System-in-Package (SiP) solutions, total investment in the company is now $25 million. With in-house processing equipment, […]