Thursday, October 22nd, 2009
If EUV lithography is to succeed, infrastructure gaps will need to be addressed forthwith. The lack of inspection tools for EUV masks and substrates constitutes one such gap, now recognized as a priority by SEMATECH. At the OSA/APS Frontiers in Optics (FiO) meeting held in San Jose, October 11-15, Carmen Menoni of Colorado State University […]