Monday, November 29th, 2010
Applied Materials lauches Centris platform for AdvantEdge MESA etch chambers, claiming 180 wph throughput, 0.8nm CD, and 30% lower CoO. Also releases new ultra HDP Silvia etch chamber for Centura, claiming $10 per wafer TSV etch.
Applied Materials launches new HVM etch platform
Tags: 32nm, Applied Materials, CD, Centris, Centura, control, CoO, DP, etch, gas, HDP, HVM, IC, litho, MFC, OEM, Silvia, TSV, uniformity
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Wednesday, February 11th, 2009
At Levitronix’s Ultrapure Fluid Handling and Wafer Cleaning Conference on February 11th, Particle Measuring Systems reviewed the limits of being able to detect things we do not want to find in flowing fluids, as enabled by a new digital detector array they call NanoVision Technology. Steven Verhaverbeke, tool design expert for Applied Materials who presented […]
Plenty of pixels size particles
Tags: 45nm, analysis, control, IC, ITRS, metrology, particle, spec
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Monday, January 12th, 2009
Rudolph Technologies today announces Discover Solar™—the first fab management software tool designed specifically to help photovoltaic (PV) manufacturers increase cell efficiency and reduce costs. Discover Solar accepts all available data from each step in the solar manufacturing process, and then applies statistical process control (SPC) algorithms to generate automated reports. A company spokesperson confirmed that […]
Rudolph’s PV fab management software
Tags: control, excursion, fab, management, MES, PV, quality, software, SPC, yield
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