Applied Materials lauches Centris platform for AdvantEdge MESA etch chambers, claiming 180 wph throughput, 0.8nm CD, and 30% lower CoO. Also releases new ultra HDP Silvia etch chamber for Centura, claiming $10 per wafer TSV etch.

Soft plasmas for monolayer etching by Ed Korczynski at NCCAVS PAG meeting at SEMICON/West 2010, including TEL Tactras RLSA and AMAT AdvantEdge Mesa for HKMG 32nm, STI, and bWL etches.

Wright Williams & Kelly (WWK), the cost and productivity modeling company, is now providing free general information in an electronic newsletter, and has lowered the cost to start using it’s flagship TWO COOL(R) cost of ownership (CoO) modeling software. The company’s “Applied Cost Modeling” newsletter features free excerpts from the book “Hi-Tech Equipment Reliability: A […]