Tuesday, April 14th, 2009
sp3 Diamond Technologies – the supplier of diamond film products, equipment, and services – today announced it is taking orders for 50mm and 100mm silicon on diamond (SOD) wafers for use as Gallium Nitride (GaN) substrates. Having worked with Nitronix on the GaN, sp3 Diamond Technologies uses combinations of thin-film depositions, wafer thinning, and layer […]
Silicon on Diamond 100mm wafers for GaN
Tags: 100mm, epi, GaN, HEMT, IC, LDMOS, materials, MOCVD, Si, SiC, SOD, thin-film, wafer
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Tuesday, March 31st, 2009
Semilab, founded in 1990 and headquartered in Budapest, Hungary, is spending cash to continue to expand its portfolio of fab metrology offerings. Today, the company announced it has acquired Advanced Metrology Systems (AMS) and QC Solutions. The two Massachusetts-based metrology companies expand Semilab’s family of scalable, flexible solutions to help semiconductor and solar manufacturers characterize […]
Semilab acquires AMS and QC Solutions companies
Tags: 45nm, epi, fab, high-k, IC, implant, Material, metal, metrology, PV, solar, test, thin-film
Posted in Equipment, fab, IC, MEMS, Product, PV | Comments Off on Semilab acquires AMS and QC Solutions companies
Thursday, March 26th, 2009
German and French teams are combining EUR 14.5m investment into development of strained-silicon on insulator (sSOI) technology under the DEvice and CIrcuit performance boosted through SIlicon material Fabrication (DECISIF) program. The work will combine original research results from Research Center Juelich and Leti/Soitec to try to lower costs and defect-densities in the creation of 300mm […]
DECISIF start on strained silicon
Tags: 22nm, 32nm, 45nm, CVD, EDA, epi, IC, implant, integration, Material, Si, SiGe, SOI, sSOI, strain, wafer
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