Posts Tagged ‘etch’
Monday, November 29th, 2010
Applied Materials lauches Centris platform for AdvantEdge MESA etch chambers, claiming 180 wph throughput, 0.8nm CD, and 30% lower CoO. Also releases new ultra HDP Silvia etch chamber for Centura, claiming $10 per wafer TSV etch.
Applied Materials launches new HVM etch platform
Tags: 32nm, Applied Materials, CD, Centris, Centura, control, CoO, DP, etch, gas, HDP, HVM, IC, litho, MFC, OEM, Silvia, TSV, uniformity
Posted in Equipment, fab, IC, Product | Comments Off on Applied Materials launches new HVM etch platform
Thursday, September 23rd, 2010
TSV for 3D integration of heterogeneous ICs used in interposers first, as shown at SEMICON/West, IMAPS, IEDM and companies like ASE, Alchimer, Suss, EVG, Novellus, Vertical Circuits, and IBM.
TSV ready in interposers at OTAPs
Tags: 3D, ASE, Cu, ECD, etch, IC, IEDM, IMAPS, Novellus, OTAP, PVD, Qualcomm, TSV
Posted in Equipment, fab, IC, Material, MEMS, Product, Service | Comments Off on TSV ready in interposers at OTAPs
Tuesday, September 7th, 2010
HP and Hynix JVA for ReRAM chips, based on HP titania memristor as covered by BetaSights April 2010, with R&D fab in Korea to start work on integration on 300mm silicon wafers for 2013 IC chips
HP with Hynix for ReRAM in 2013
Tags: 16nm, 22nm, AI, DRAM, etch, Flash, HDD, IC, litho, logic, memory, memristor, NAND, PVD, R&D, ReRAM, SSDP
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on HP with Hynix for ReRAM in 2013
Monday, July 19th, 2010
Soft plasmas for monolayer etching by Ed Korczynski at NCCAVS PAG meeting at SEMICON/West 2010, including TEL Tactras RLSA and AMAT AdvantEdge Mesa for HKMG 32nm, STI, and bWL etches.
Soft plasmas for monolayer etching
Tags: 22nm, 32nm, 45nm, ALD, ALE, CMOS, CoO, Denard, etch, HKMG, IC, plasma
Posted in Equipment, fab, IC, MEMS, Product | Comments Off on Soft plasmas for monolayer etching
Monday, April 6th, 2009
Applied Materials and Disco announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSV) for future 3D IC stacks. The two companies, world leaders in thin-films and thinning (respectively) for silicon wafers, will be working together to develop integrated, high-performance process flows intended to lower the cost, reduce the risk and […]
Applied Materials and Disco 3D TSV joint effort
Tags: 3D, Cu, DRIE, etch, IC, integration, TSV
Posted in fab, IC, MEMS | Comments Off on Applied Materials and Disco 3D TSV joint effort
Thursday, March 12th, 2009
Stangl Semiconductor Equipment has launched its Linea horizontal inline wet process platform for cleaning and etching of crystalline silicon PV wafers. The fully-automated dry-in/dry-out system offers reliable production capacity of up to 3,400 wafers per hour (wph) corresponding to an estimated 60 MW per line running 156mm wafers. The system can also be configured at […]
Stangl inline PV wet tool
Tags: chemical, clean, etch, inline, PV, Si, wet
Posted in Equipment, fab, Product, PV | Comments Off on Stangl inline PV wet tool
Wednesday, March 11th, 2009
Nanometrics today announced the release of Version 2.0 of its NanoCD Suite of solutions for optical critical dimension (OCD) metrology, just one year after V1 was released. OCD (a.k.a., “scatterometry”) has been used to successfully control fab processes for many years. The major known limitation of the technique is model building from reference metrology data, […]
Nanometrics next NanoCD Suite for OCD
Tags: 22nm, 32nm, CD, CMP, etch, fab, finFET, high-k, HK, IC, metal-gate, metrology, MG, OCD
Posted in Equipment, fab, IC, Product | Comments Off on Nanometrics next NanoCD Suite for OCD
Thursday, February 12th, 2009
CaliSolar is ramping production of upgraded metallurgical-grade silicon (UMG-Si) solar cells and has selected Eyelit’s manufacturing software suite to support its new fab next to its headquarters in Sunnyvale, California. CaliSolar is a private company claiming 15% conversion efficiency from cell made using 100% UMG-Si feedstock that undergoes purification at both the ingot and wafer […]
CaliSolar UMG-Si PV cells ramping
Tags: anneal, efficiency, etch, getter, MES, patent, PV, Si, UMG
Posted in fab, Product, PV, Service | Comments Off on CaliSolar UMG-Si PV cells ramping