Posts Tagged ‘FPD’
Monday, March 22nd, 2010
The upcoming Spring Materials Research Society (MRS) Meeting in San Francisco will feature a separate “Nanocontact and Nanointerconnects Workshop” to explore the biggest secret about the smallest devices: for the near-term there’s nothing better than standard metal. The workshop will address both theoretical and experimental approaches to formation, carrier transport, and reliability, and so will […]
How to connect to nano devices
Tags: 22nm, CMOS, CNT, Cu, FET, FPD, IC, memory, MEMS, nano, PV, R&D
Posted in Equipment, fab, FPD, IC, Material, MEMS, PV | Comments Off on How to connect to nano devices
Wednesday, April 29th, 2009
Thermal management of advanced ICs remains challenging, with models often failing to predict the heat flow through multiple films and interfaces. Advanced Thermal Solutions (ATS) of Norwood, Massachusetts (US) will provide a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to engineers who need to perform thermal testing of their heat sinks, […]
Free thermal characterization lab time
Tags: characterization, FPD, IC, MEMS, Service, test, thermal
Posted in fab, IC, MEMS, Product, PV, Service | Comments Off on Free thermal characterization lab time
Monday, April 20th, 2009
The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]
MRS spring meeting beyond Silicon Valley
Tags: 32nm, 3D, CMOS, FPD, high-k, HKMG, IC, low-k, materials, memory, MEMS, NVM, PV, R&D, Si
Posted in fab, FPD, IC, MEMS, PV | Comments Off on MRS spring meeting beyond Silicon Valley
Wednesday, April 1st, 2009
Asahi Glass is promoting a family of new photosensitive spin-on-dielectric (SOD) films for fan-out WLP and 3D packages, as well as for FPD and MEMS applications. The Chemicals Fluoroproducts Division of Asahi Glass has successfully developed the AL-X polymer series, primarily targeting the redistribution/rewiring layers in fan-out WLP packages. The company will begin production of […]
Asahi Glass photo-SOD
Tags: 3D, FPD, IC, litho, low-k, Material, MEMS, package, photo-SOD, SOD, spin-on, WLP
Posted in fab, FPD, IC, Material, MEMS, Product | Comments Off on Asahi Glass photo-SOD
Monday, March 23rd, 2009
Keithley Instruments has been very busy extending the capabilities of it’s 4200-SCS (Semiconductor Characterization System) with new cables for IC measurements and new software libraries for PV, OLED, and other devices. The 4200-SCS replaces a variety of electrical test tools with a single integrated characterization solution, and works for applications including semiconductor technology development, process […]
Keithley 4200-SCS upgrades
Tags: C-V, characterization, FPD, I-V, IC, OLED, prober, PV, Semiconductor, test
Posted in Equipment, fab, FPD, IC, MEMS, Product, PV | Comments Off on Keithley 4200-SCS upgrades
Wednesday, March 18th, 2009
Wright Williams & Kelly (WWK), the cost and productivity modeling company, is now providing free general information in an electronic newsletter, and has lowered the cost to start using it’s flagship TWO COOL(R) cost of ownership (CoO) modeling software. The company’s “Applied Cost Modeling” newsletter features free excerpts from the book “Hi-Tech Equipment Reliability: A […]
WWK cost modeling tools
Tags: CoO, fab, FPD, IC, MEMS, model, OEE, PV
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Friday, March 13th, 2009
Trust is the foundation of all trade and business. Without trust, no deal can get done, no venture can be launched, no discussion can even begin. Trust has been shaken in individual businesses in recent years, but recently exposed financial scams have shaken confidence not just in one or a collection of companies but almost […]
Trust your fab – CDO vs CDO
Tags: CDO, fab, FPD, IC, MEMS, PV, R&D
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Thursday, January 8th, 2009
Samsung has launched a new press release for “super-thin LED monitors” (http://www.businesswire.com/news/home/20090107006252/en) that are really LCDs with LED backlight units (BLU). The company’s new P2370L is just 16.5mm thick and uses white LED instead of cold cathode fluorescent lamp (CCFL) illumination. Compared to CCLF units, LED BLUs consume 30% less energy, are constructed without mercury, […]
Samsung LED backlighting proliferates
Tags: backlight, BLU, FPD, InGaN, LCD, LED, lighting, MOCVD, Osram, Samsung
Posted in Equipment, fab, FPD, Material | Comments Off on Samsung LED backlighting proliferates
Sunday, January 4th, 2009
This is the first example of a posting to BetaSights new BetaBlog. New posts will appear most working days, so bookmark this site and check back regularly. BetaSights was founded in the fall of 2008 by industry veterans Ed Korczynski and Elizabeth Schumann, to provide commercial free, member supported, productive info about fab beta sites. […]
Welcome to the beginning of BetaBlog(SM)
Tags: Equipment, fab, FPD, IC, materials, MEMS, PV, Service
Posted in Equipment, fab, FPD, IC, Material, MEMS, Product, PV, Service | Comments Off on Welcome to the beginning of BetaBlog(SM)