Qcept Technologies’ ChemitriQ5000 may help GlobalFoundries vs. TSMC in gate-first HKMG integration for 32nm foundry customers with fab metrology for control of yield excursions

Soft plasmas for monolayer etching by Ed Korczynski at NCCAVS PAG meeting at SEMICON/West 2010, including TEL Tactras RLSA and AMAT AdvantEdge Mesa for HKMG 32nm, STI, and bWL etches.

Another back-to-the-future possibility for next-generation lithography (NGL) is direct write e-beam (DWEB), revitalized with multibeam clusters, curvilinear mask writing, and character projection (CP). The E-beam Initiative used the recent SPIE gathering to announce that it had added six new member companies, including GlobalFoundries and Samsung. Aki Fujimura, CEO of D2S and Managing Director of the […]

At the SEMICON West 2009 Device Scaling TechXPOT, moderated by this editor, SEMATECH’s Ray Jammy reviewed the latest results in scaling CMOS transistors. “We are litererally running out of atoms,” explained Jammy. “You can see the number of atoms in a gate dielectric.” When you have such thin layers, how do you control device parameters? […]

The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]

After the 1st “act” of the story of Intel as a memory chip company founded in 1969, the 2nd act really started in 1985 with the decision to bet the company on the 80386 microprocessor according to Richard S. Tedlow, Harvard Business School professor and residential scholar of the Computer History Museum, in a lecture […]