Friday, September 18th, 2009
At SEMICON West this year, ASML announced tools that fleshed out their Holistic Lithography scheme introduced at SPIE’s Advanced Lithography Symposium in February of this year. The key idea of Holistic Lithography, according to Bert Koek, senior vice president of the applications products group at ASML, is integrating computational lithography, wafer printing, and process control […]
Lithography going holistic
Tags: 22nm, 32nm, computational, i193, IC, litho, OPC, SMO
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Wednesday, February 25th, 2009
Applied Materials’ Technical Symposium at SPIE 2009 featured a panel discussion on next generation lithography (NGL) that was moderated by the company’s Ken MacWIlliams. The outstanding panelists were C. Grant Willson (UT-Austin), Burn Lin (TSMC), Jongwook Kye (AMD), Steve Radigan (Sandisk), and Milind Weling (Cadence). As would be expected from this panel, EUV steppers were […]
IC next-generation litho needs all possible tricks
Tags: DP, EbDR, i193, litho, NIL, stepper
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Tuesday, February 24th, 2009
At the Nikon Lithovisions 2009 Symposium on February 22 this year in San Jose, California, Masato Hamatani described the features and beta test results for the NSR-S620 scanning immersion exposure tool, optimized for double patterning lithography. While the tool boasts only one wafer stage, its “Streamlign Platform” concept shoots 200 wafers per hour with 2nm […]
Nikon NSR-S620: Single Stage Double Patterning
Tags: beta, DP, i193, litho, stepper
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Friday, February 20th, 2009
As computational lithography has become big big business, the pioneering enterprises have been assimilated into larger organizations (KLA-Tencor for Finle and Synopsys for Sigma-C, to name two examples). Panoramic Technology, however, continues its independence, supplying trustworthy and up-to-date simulators to advanced lithographers for a decade. Past Panoramic products, however, employed an interface that was familiar […]
Independent computational lithography simulator
Tags: DUV, EUV, i193, IC, litho, model, OPC
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