Tuesday, December 14th, 2010
Through-silicon vias (TSV) by IBM and Semtech for ADC/DSP solutions use copper and deep-trench capacitors for RF applications; IEDM 2010 papers show TSV in active chips progressing slowly.
TSV interposers by IBM/Semtech for ADC/DSP
Tags: 65nm, 90nm, ADC/DSP, CEA-Leti, Cu, FPGA, IBM, IC, interposer, MLM, Semtech, Si, TSMC, TSV, W
Posted in fab, IC, Material, Product, Service | Comments Off on TSV interposers by IBM/Semtech for ADC/DSP
Monday, November 8th, 2010
Xilinx 28nm FPGA Virtex-7 uses TSMC 65nm multi-level-metal (MLM) and through-silicon-via (TSV) Si-interposer for 2M gate and ARM-core integration product family.
Xilinx uses TSV+MLM interposers for 28nm FPGA
Tags: 22nm, 28nm, 32nm, ARM, ASSID, Cu, FPGA, IC, IEEE, integration, interposer, IZM, MLM, Si, SoC, TSMC, TSV, Xilinx, yield
Posted in fab, IC, Product, Service | Comments Off on Xilinx uses TSV+MLM interposers for 28nm FPGA
