Wednesday, July 22nd, 2009
At SEMICON West and Intersolar North America last week in San Francisco, crossing guards danced to keep the throngs away from the vehicles at the corner of 4th and Howard, as many people flowed back and forth between the shows co-located across 4th Street from each other. SEMICON West, down ~30% in size from last […]
Intersolar and SEMICON in SF show fab tech marches on
Tags: 22nm, 32nm, IC, Material, OEM, PV, SEMI, Semiconductor
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Wednesday, April 1st, 2009
Asahi Glass is promoting a family of new photosensitive spin-on-dielectric (SOD) films for fan-out WLP and 3D packages, as well as for FPD and MEMS applications. The Chemicals Fluoroproducts Division of Asahi Glass has successfully developed the AL-X polymer series, primarily targeting the redistribution/rewiring layers in fan-out WLP packages. The company will begin production of […]
Asahi Glass photo-SOD
Tags: 3D, FPD, IC, litho, low-k, Material, MEMS, package, photo-SOD, SOD, spin-on, WLP
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Tuesday, March 31st, 2009
Semilab, founded in 1990 and headquartered in Budapest, Hungary, is spending cash to continue to expand its portfolio of fab metrology offerings. Today, the company announced it has acquired Advanced Metrology Systems (AMS) and QC Solutions. The two Massachusetts-based metrology companies expand Semilab’s family of scalable, flexible solutions to help semiconductor and solar manufacturers characterize […]
Semilab acquires AMS and QC Solutions companies
Tags: 45nm, epi, fab, high-k, IC, implant, Material, metal, metrology, PV, solar, test, thin-film
Posted in Equipment, fab, IC, MEMS, Product, PV | Comments Off on Semilab acquires AMS and QC Solutions companies
Thursday, March 26th, 2009
German and French teams are combining EUR 14.5m investment into development of strained-silicon on insulator (sSOI) technology under the DEvice and CIrcuit performance boosted through SIlicon material Fabrication (DECISIF) program. The work will combine original research results from Research Center Juelich and Leti/Soitec to try to lower costs and defect-densities in the creation of 300mm […]
DECISIF start on strained silicon
Tags: 22nm, 32nm, 45nm, CVD, EDA, epi, IC, implant, integration, Material, Si, SiGe, SOI, sSOI, strain, wafer
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Wednesday, March 25th, 2009
Novaled, the provider of Organic Light Emitting Diode (OLED) technology and materials, and Holst Centre, an independent R&D centre developing generic technologies for Wireless Autonomous Transducer Solutions and for Systems-in-Foil, have decided to collaborate on the development of organic thin film transistor (OTFT) technologies under a joint development agreement. Novaled will provide its organic dopants […]
Novaled and Holst Centre JDA on OTFT
Tags: CMOS, dopant, IC, Material, OLED, organic, OTFT, TFT
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