Monday, November 29th, 2010
Applied Materials lauches Centris platform for AdvantEdge MESA etch chambers, claiming 180 wph throughput, 0.8nm CD, and 30% lower CoO. Also releases new ultra HDP Silvia etch chamber for Centura, claiming $10 per wafer TSV etch.
Applied Materials launches new HVM etch platform
Tags: 32nm, Applied Materials, CD, Centris, Centura, control, CoO, DP, etch, gas, HDP, HVM, IC, litho, MFC, OEM, Silvia, TSV, uniformity
Posted in Equipment, fab, IC, Product | Comments Off on Applied Materials launches new HVM etch platform
