IEDM 2010 best hints at 22nm node fab tech alternate-channel materials, dual- and tri-gate transistors, and RF, MEMS, lab-on-chip, graphene, analog, memory ReRAM results.

The upcoming Spring Materials Research Society (MRS) Meeting in San Francisco will feature a separate “Nanocontact and Nanointerconnects Workshop” to explore the biggest secret about the smallest devices: for the near-term there’s nothing better than standard metal. The workshop will address both theoretical and experimental approaches to formation, carrier transport, and reliability, and so will […]

Founded in 1984 with Flemish government support, IMEC has reached 25 years. To celebrate the organization’s accomplishments, BetaSights joined other industry media outlets attending a research review event in beautiful Leuven, Belgium. From 1999 to 2009 has been the “phase of international breakthrough” as described by current president Luc Van den hove. Working with OEMs […]

IMEC/F-IZM/SUSS/TM vs. SEMATECH/Leti/EVG/Brewer. The leading R&D consortia have aligned (pun intended) with leading equipment and materials suppliers to create ultra-thin silicon wafer handling technologies for 3D ICs. With the ability to shrink circuit dimensions in 2D becoming ever more difficult, most of the world’s IC fab leaders are evaluating the use of the 3rd dimension. […]

James Quinn, CEO of Replisaurus, has been very busy executing for the last few years to bring his vision of a new metallization technology to the IC fab industry. Targeting the formation of Cu interconnects for advanced packaging applications, Quinn has assembled a great team to work with CEA-Leti and other industrial partners on a […]

Thermal management of advanced ICs remains challenging, with models often failing to predict the heat flow through multiple films and interfaces. Advanced Thermal Solutions (ATS) of Norwood, Massachusetts (US) will provide a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to engineers who need to perform thermal testing of their heat sinks, […]

The Materials Research Society (MRS) Spring Meeting in San Francisco is so huge, this year attracting a record of over 5,000 attendees, that strategy is needed to try to see any representative sample of the event. To provide in-depth information about new materials technologies, new symposia have been added over the years such that there […]

The SPIE Europe Microtechnologies For the New Millennium congress has new partners this year, with the involvement of GMM, the Society of Microelectronics, Micro and Precision Engineering and the magazine mst|news as Cooperating Organisations for the first time. The event will be held at the Congress Centre Maritim Hotel in Dresden, Germany, 4-6 May 2009. […]

Asahi Glass is promoting a family of new photosensitive spin-on-dielectric (SOD) films for fan-out WLP and 3D packages, as well as for FPD and MEMS applications. The Chemicals Fluoroproducts Division of Asahi Glass has successfully developed the AL-X polymer series, primarily targeting the redistribution/rewiring layers in fan-out WLP packages. The company will begin production of […]

Materials research and engineering continues to increase in structural complexity. Starting from the periodic table of the elements and molecular engineering, over a century of research has explored most obvious phenomena of bulk and thin-film materials. What, then, is left to explore? The vast complexity of natural micro- and nano-scale structures that are indirectly templated […]