Thursday, March 19th, 2009
Mentor Graphics has announced new capabilities to the Calibre(R) platform to allow designers to control thickness variability due to Chemical Mechanical Planarization (CMP) at advanced process nodes. Designers can transition from dummy fill to density-based fill, or to full model-based fill, depending on the demands of their designs and target manufacturing process. The new capability […]
Mentor 3D solves CMP variation
Tags: 45nm, 65nm, CMP, EDA, fill, IC, metal, model, variation
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Wednesday, March 18th, 2009
Wright Williams & Kelly (WWK), the cost and productivity modeling company, is now providing free general information in an electronic newsletter, and has lowered the cost to start using it’s flagship TWO COOL(R) cost of ownership (CoO) modeling software. The company’s “Applied Cost Modeling” newsletter features free excerpts from the book “Hi-Tech Equipment Reliability: A […]
WWK cost modeling tools
Tags: CoO, fab, FPD, IC, MEMS, model, OEE, PV
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Friday, February 20th, 2009
As computational lithography has become big big business, the pioneering enterprises have been assimilated into larger organizations (KLA-Tencor for Finle and Synopsys for Sigma-C, to name two examples). Panoramic Technology, however, continues its independence, supplying trustworthy and up-to-date simulators to advanced lithographers for a decade. Past Panoramic products, however, employed an interface that was familiar […]
Independent computational lithography simulator
Tags: DUV, EUV, i193, IC, litho, model, OPC
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