Tuesday, December 1st, 2009
Based on proven hardware sub-systems from previous models, Applied Materials has released a new chemical-mechanical planarization (CMP) tool that processes two 300mm diameter wafers simultaneously on each of two plattens. Initially targeting copper interconnect formation for memory ICs, the Reflexion GT tool has passed betasite tests at multiple customers, and reportedly provides 60% higher throughput […]
Applied Materials CMP tool dances the two-step
Tags: 4Xnm, CMP, cost, Cu, DRAM, fab, IC, OEM, slurry, tool, W
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Tuesday, February 10th, 2009
CMP applications experts gathered in Santa Clara, California on February 10th to share their experience and expertise at the fifth annual seminar sponsored by Levitronix. Leading developers, manufacturers, and end-users of CMP discussed all aspects of the technology, and since Levitronix makes magnetic levitation (MagLev) pumps there were many thorough presentations on slurry distribution issues. […]
Levitronix seminar shows how to do CMP
Tags: analysis, CMP, fab, IC, metrology, slurry, yield
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