Friday, January 16th, 2009
At SEMI’s SMC yesterday, Sung Wook Park, executive vice president and general manager of Hynix Semiconductor, provided a keynote address on the materials needs for mainstream memory chips over the next decade. DRAMs will likely turn into STTRAMs, and NAND Flash will probably be replaced by ReRAM (Ref: Ed’s Threads 080505). Combinatorial materials R&D company […]
Hynix sees STTRAM and ReRAM some day
Tags: DRAM, Flash, materials, memory, MTJ, NAND, PCM, R&D, RAM, ReRAM, SMC, STT, TMR
Posted in Equipment, fab, IC, Material, Product | Comments Off on Hynix sees STTRAM and ReRAM some day
Thursday, January 15th, 2009
As SEMI’s SMC today, Raymond Roberge, SVP and CTO of Praxair Electronics, proposed a pragmatic new collaboration model for electronic materials R&D. Semiconductor fab process materials TAM for 2008 was ~$10B, yet materials suppliers now question their ongoing profitability. “Certainly the 300mm shift has resulted in productivity advances for IDMs at the expense of materials […]
Praxair’s materials R&D collaboration model
Tags: 300mm, ALD, CMP, electronic, fab, IC, IDM, materials, OEM, R&D, SMC, supplier
Posted in fab, FPD, IC, Material, MEMS, Product, PV | Comments Off on Praxair’s materials R&D collaboration model