SPIE Advanced Lithography 2011 showed few new tools or techniques, but many new materials and integration tricks to extend 193i into double-patterning for IC HVM, while EUV and DSA developments continue according to expert Dr. M. David Levenson of BetaSights.

Direct-write, maskless, lithography using e-beams is not ready for 22nm node IC manufacturing, and the SPIE BACUS presentations show EbDW issues include data transfer and inspection.

E-beam Initiative adds four members and starts on Design for E-beam (DFEB) for mask makng for ICs to reduce mask costs at 22nm and below.

The SPIE Europe Microtechnologies For the New Millennium congress has new partners this year, with the involvement of GMM, the Society of Microelectronics, Micro and Precision Engineering and the magazine mst|news as Cooperating Organisations for the first time. The event will be held at the Congress Centre Maritim Hotel in Dresden, Germany, 4-6 May 2009. […]