Wednesday, April 1st, 2009
Asahi Glass is promoting a family of new photosensitive spin-on-dielectric (SOD) films for fan-out WLP and 3D packages, as well as for FPD and MEMS applications. The Chemicals Fluoroproducts Division of Asahi Glass has successfully developed the AL-X polymer series, primarily targeting the redistribution/rewiring layers in fan-out WLP packages. The company will begin production of […]
Asahi Glass photo-SOD
Tags: 3D, FPD, IC, litho, low-k, Material, MEMS, package, photo-SOD, SOD, spin-on, WLP
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Thursday, February 19th, 2009
JSR announced today that it has entered into several joint development partnerships (JDP) with IBM to develop low-k dielectrics for 32nm and 22nm nodes of semiconductor technology. The companies will work on next generation materials JSR has had in development and commercial production, including low-k dielectrics and a broad range of photoresists. “This larger scale […]
JSR and IBM low-k JDPs for 32/22nm
Tags: 32nm, Cu, CVD, IC, litho, low-k, porous, resist, spin-on, ULK
Posted in fab, IC, Material, Product | Comments Off on JSR and IBM low-k JDPs for 32/22nm