Tuesday, September 7th, 2010
HP and Hynix JVA for ReRAM chips, based on HP titania memristor as covered by BetaSights April 2010, with R&D fab in Korea to start work on integration on 300mm silicon wafers for 2013 IC chips
HP with Hynix for ReRAM in 2013
Tags: 16nm, 22nm, AI, DRAM, etch, Flash, HDD, IC, litho, logic, memory, memristor, NAND, PVD, R&D, ReRAM, SSDP
Posted in Equipment, fab, IC, Material, Product, Service | Comments Off on HP with Hynix for ReRAM in 2013
Wednesday, August 25th, 2010
For 32nm and 22nm node ICs, Applied Materials’ FCVD and Novellus Systems’ CFD technologies provide gapfill, sidewall spacers, and conformal oxides for logic and NAND, plus SSDP litho.
IC industry contracts new VDs: CFD and FCVD
Tags: 22nm, 32nm, ALD, CVD, dielectric, fab, HDP-CVD, IC, integration, litho, logic, materials, memory, NAND, node, PECVD, SOG, SSDP
Posted in Equipment, fab, IC, Material, Product | Comments Off on IC industry contracts new VDs: CFD and FCVD
