Novellus’ applications labs have been working on CVD low-k dielectrics targeting 32nm node multilevel metal specs, and the result is “dense” ultra-low-k (ULK) film with bulk k=2.5 and the potential to go lower. Combined with the company’s multi-station sequential processing (MSSP) tool architecture for the barrier/cap depositions and UV/thermal cure steps, the result is a […]

JSR announced today that it has entered into several joint development partnerships (JDP) with IBM to develop low-k dielectrics for 32nm and 22nm nodes of semiconductor technology. The companies will work on next generation materials JSR has had in development and commercial production, including low-k dielectrics and a broad range of photoresists. “This larger scale […]